A full-wave finite element analysis is used to examine the dispersive effects of a thin metal-insulating layer in CPW and microstrip MMICs. This layer is often encountered in the MMIC manufacturing process residing on top of a semiconducting substrate. The effects of metallization thickness are also examined.
|Number of pages||4|
|Journal||IEEE MTT-S International Microwave Symposium Digest|
|Publication status||Published - 1996|