Dispersive effects of a thin metal-insulating layer in MMIC structures

Anastasis C. Polycarpou, Michael R. Lyons, Constantine A. Balanis

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A full-wave finite element analysis is used to examine the dispersive effects of a thin metal-insulating layer in CPW and microstrip MMICs. This layer is often encountered in the MMIC manufacturing process residing on top of a semiconducting substrate. The effects of metallization thickness are also examined.

Original languageEnglish
Pages (from-to)303-306
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume1
Publication statusPublished - 1996

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