Abstract
In this study thermal phenomena in micro and nanofluid flows are investigated. A better insight on the thermal interactions involved inside micro and nanofluidic devices is essential for optimising their performance. The fidelity of the computational models employed for the thermal wall is examined. Molecular dynamics simulations are utilised to exploit the impact of the wall models on the heat transfer across the solid-liquid interface. The performed simulations revealed that the thermalisation procedure and the solid’s bond stiffness have a direct impact on the thermal transfer to and from the solid boundary. Therefore, their selection has to be thoroughly examined.
Original language | English |
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Pages (from-to) | 101-104 |
Number of pages | 4 |
Journal | International Conference on Computational Methods for Thermal Problems |
Issue number | 223599 |
Publication status | Published - 2009 |
Externally published | Yes |
Event | 1st International Conference on Computational Methods for Thermal Problems, THERMACOMP 2009 - Naples, Italy Duration: 8 Sept 2009 → 10 Sept 2009 |
Keywords
- Heat transfer
- Micro/nanofluid dynamics
- Molecular dynamics
- Thermal walls